Three Dimensional Integrated Circuit Design

Written By Yuan Xie
Three Dimensional Integrated Circuit Design
  • Publsiher : Springer
  • Release : 10 December 2009
  • ISBN : 9781441907837
  • Pages : 284 pages
  • Rating : 4/5 from 21 reviews
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Read or download book entitled Three Dimensional Integrated Circuit Design written by Yuan Xie which was release on 10 December 2009, this book published by Springer. Available in PDF, EPUB and Kindle Format. Book excerpt: We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer
  • Release Date : 2009-12-10
  • Total pages : 284
  • ISBN : 9781441907837
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Summary : We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance ...

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Yuan Xie,Jingsheng Jason Cong,Sachin Sapatnekar
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-12-02
  • Total pages : 284
  • ISBN : 9781441907837
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Summary : We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance ...

Three Dimensional Integrated Circuit Design

Three Dimensional Integrated Circuit Design
  • Author : Vasilis F. Pavlidis,Ioannis Savidis,Eby G. Friedman
  • Publisher : Newnes
  • Release Date : 2017-07-04
  • Total pages : 768
  • ISBN : 9781441907837
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Summary : Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing ...

Three Dimensional Integrated Circuit Layout

Three Dimensional Integrated Circuit Layout
  • Author : A. C. Harter
  • Publisher : Cambridge University Press
  • Release Date : 1991-11-28
  • Total pages : 207
  • ISBN : 9781441907837
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Summary : First published in 1991, this thesis concentrates upon the design of three-dimensional, rather than the traditional two-dimensional, circuits. The theory behind such circuits is presented in detail, together with experimental results....

Three Dimensional Integrated Circuit Design and Test

Three Dimensional Integrated Circuit Design and Test
  • Author : Jing Xie
  • Publisher : Unknown
  • Release Date : 2015
  • Total pages : 212
  • ISBN : 9781441907837
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Summary : The emerging three-dimensional integrated circuits (3D ICs) is one of the most promising solutions for future IC designs. 3D stacking enables much higher memory bandwidth and much lower overhead in multi-power domain design, which provides solutions for chip-multiprocessor design in mitigating the "memory wall" and "dark-silicon" problem. At the same ...

Design Automation and Analysis of Three dimensional Integrated Circuits

Design Automation and Analysis of Three dimensional Integrated Circuits
  • Author : Shamik Das
  • Publisher : Unknown
  • Release Date : 2004
  • Total pages : 176
  • ISBN : 9781441907837
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Summary : (Cont.) technologies may be leveraged to maintain acceptable die temperatures in 3-D ICs. Finally, we explore two issues for the future of 3-D integration. We determine how technology scaling impacts the effect of 3-D integration on circuit performance. We also consider how to improve the performance of digital components in ...

Three Dimensional System Integration

Three Dimensional System Integration
  • Author : Antonis Papanikolaou,Dimitrios Soudris,Riko Radojcic
  • Publisher : Springer Science & Business Media
  • Release Date : 2010-12-07
  • Total pages : 246
  • ISBN : 9781441907837
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Summary : Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful ...

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits
  • Author : Aida Todri-Sanial,Chuan Seng Tan
  • Publisher : CRC Press
  • Release Date : 2017-12-19
  • Total pages : 397
  • ISBN : 9781441907837
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Summary : Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, ...

Design of 3D Integrated Circuits and Systems

Design of 3D Integrated Circuits and Systems
  • Author : Rohit Sharma
  • Publisher : CRC Press
  • Release Date : 2018-09-03
  • Total pages : 324
  • ISBN : 9781441907837
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Summary : Three-dimensional (3D) integration of microsystems and subsystems has become essential to the future of semiconductor technology development. 3D integration requires a greater understanding of several interconnected systems stacked over each other. While this vertical growth profoundly increases the system functionality, it also exponentially increases the design complexity. Design of 3D ...

Repair Methodology and Repairable Design of Three Dimensional Integrated Circuit

Repair Methodology and Repairable Design of Three Dimensional Integrated Circuit
  • Author : 周永發
  • Publisher : Unknown
  • Release Date : 2011
  • Total pages : 212
  • ISBN : 9781441907837
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Summary : Download or read online Repair Methodology and Repairable Design of Three Dimensional Integrated Circuit written by 周永發, published by which was released on 2011. Get Repair Methodology and Repairable Design of Three Dimensional Integrated Circuit Books now! Available in PDF, ePub and Kindle....

Electrical Modeling and Design for 3D System Integration

Electrical Modeling and Design for 3D System Integration
  • Author : Er-Ping Li
  • Publisher : John Wiley & Sons
  • Release Date : 2012-04-10
  • Total pages : 384
  • ISBN : 9781441907837
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Summary : New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity as well as electromagnetic interference in large complex electronic interconnects, multilayered package ...

Design and Verification Methodology for Complex Three Dimensional Digital Integrated Circuit

Design and Verification Methodology for Complex Three Dimensional Digital Integrated Circuit
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 2004
  • Total pages : 212
  • ISBN : 9781441907837
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Summary : Three-Dimensional Integrated Circuits (3DICs) have recently attracted great interest from researchers and IC designers as a possible solution to fill the gap between device and interconnect scaling. Various studies have demonstrated the potential performance improvement of 3DICs by eliminating long interconnects, repeaters, and clock buffers. Though 3DICs are attractive, there ...

Arbitrary Modeling of TSVs for 3D Integrated Circuits

Arbitrary Modeling of TSVs for 3D Integrated Circuits
  • Author : Khaled Salah,Yehea Ismail,Alaa El-Rouby
  • Publisher : Springer
  • Release Date : 2014-08-21
  • Total pages : 179
  • ISBN : 9781441907837
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Summary : This book presents a wide-band and technology independent, SPICE-compatible RLC model for through-silicon vias (TSVs) in 3D integrated circuits. This model accounts for a variety of effects, including skin effect, depletion capacitance and nearby contact effects. Readers will benefit from in-depth coverage of concepts and technology such as 3D integration, ...

System Design of Multi Layer Three Dimensional Integrated Circuits

System Design of Multi Layer  Three Dimensional  Integrated Circuits
  • Author : J. F. Gibbons,STANFORD UNIV CA STANFORD ELECTRONICS LABS.
  • Publisher : Unknown
  • Release Date : 1985
  • Total pages : 17
  • ISBN : 9781441907837
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Summary : Research carried out on beam processing of semiconductors led to the concept of a three dimensional integrated circuit. It was shown that MOS devices could be made on both sides of a laser-recrystallized thin film of silicon, deposited on an insulating substrate (SOI) and also on vertically arranged, recrystallized silicon ...

Designing TSVs for 3D Integrated Circuits

Designing TSVs for 3D Integrated Circuits
  • Author : Nauman Khan,Soha Hassoun
  • Publisher : Springer Science & Business Media
  • Release Date : 2012-09-22
  • Total pages : 76
  • ISBN : 9781441907837
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Summary : This book explores the challenges and presents best strategies for designing Through-Silicon Vias (TSVs) for 3D integrated circuits. It describes a novel technique to mitigate TSV-induced noise, the GND Plug, which is superior to others adapted from 2-D planar technologies, such as a backside ground plane and traditional substrate contacts. ...