Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Written By E-H Wong
Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture
  • Publsiher : Woodhead Publishing
  • Release : 23 May 2015
  • ISBN : 0857099116
  • Pages : 482 pages
  • Rating : 4/5 from 21 reviews
GET THIS BOOKRobust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture


Read or download book entitled Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture written by E-H Wong which was release on 23 May 2015, this book published by Woodhead Publishing. Available in PDF, EPUB and Kindle Format. Book excerpt: Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. Discusses how the reliability of packaging components is a prime concern to electronics manufacturers Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques Includes program files and macros for additional study

Robust Design of Microelectronics Assemblies Against Mechanical Shock Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock  Temperature and Moisture
  • Author : E-H Wong,Y.-W. Mai
  • Publisher : Woodhead Publishing
  • Release Date : 2015-05-23
  • Total pages : 482
  • ISBN : 0857099116
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Summary : Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and ...

Cyber Physical Systems Design and Application for Industry 4 0

Cyber Physical Systems  Design and Application for Industry 4 0
  • Author : Alla G. Kravets
  • Publisher : Springer Nature
  • Release Date : 2021-05-17
  • Total pages : 212
  • ISBN : 0857099116
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Summary : Download or read online Cyber Physical Systems Design and Application for Industry 4 0 written by Alla G. Kravets, published by Springer Nature which was released on . Get Cyber Physical Systems Design and Application for Industry 4 0 Books now! Available in PDF, ePub and Kindle....

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Proceedings of the     International Symposium on Microelectronics
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1999
  • Total pages : 212
  • ISBN : 0857099116
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Proceedings 1998 International Symposium on Microelectronics
  • Author : Anonim
  • Publisher : Society of Photo Optical
  • Release Date : 1998
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  • Author : Dick Gehman,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers
  • Publisher : Unknown
  • Release Date : 1999
  • Total pages : 806
  • ISBN : 0857099116
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Summary : Download or read online Proceedings 1999 International Symposium on Microelectronics written by Dick Gehman,International Microelectronics and Packaging Society,Society of Photo-optical Instrumentation Engineers, published by which was released on 1999. Get Proceedings 1999 International Symposium on Microelectronics Books now! Available in PDF, ePub and Kindle....

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  • ISBN : 0857099116
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Summary : Collection of selected, peer reviewed papers from the 2014 International Conference on Intelligent Mechanics and Materials Engineering (ICIMME 2014), December 27-28, 2014, Shenzhen, China. The 378 papers are grouped as follows: Chapter 1: Materials Science and Processing Technologies, Chemical Processes and Biotechnologies; Chapter 2: Construction and Structural Engineering, Materials and Technologies; Chapter 3: General Mechanical Engineering, Applied ...

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  • ISBN : 0857099116
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Summary : Collection of selected, peer reviewed papers from the 2014 2nd International Conference on Precision Mechanical Instruments and Measurement Technology (ICPMIMT 2014), May 30-31, 2014, Chongqing, China. The 885 papers are grouped as follows: Chapter 1: Mechanics and Dynamics, Applied Mechanics, Advanced Development in Manufacturing and Industry Engineering, Chapter 2: Mechatronics, Automation and Control, Intelligent Algorithms for ...

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  • Author : Anonim
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  • Release Date : 2013-02-13
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Summary : Volume is indexed by Thomson Reuters CPCI-S (WoS). The papers of this 4 volumes set on "Sensors, Measurement and Intelligent Materials" are grouped as follows: Chapter 1: Intelligent Materials and Structures; Chapter 2: Sensors; Chapter 3: Techniques for Measurement, Detection and Monitoring; Chapter 4: Data Acquisition, Data Mining and Data Processing; Chapter 5: Automation and Control. ...

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Summary : The 2011 International Conference on Information Technology for Manufacturing Systems (ITMS 2011) was co-sponsored by the University of Adelaide, Australia and Huazhong University of Science and Technology, China. Its mission was to bring together innovative academics and industrial experts in the field of Materials Science and Mechanical Science. Volume is indexed by ...