Reflow Soldering Processes

Written By Ning-Cheng Lee
Reflow Soldering Processes
  • Publsiher : Elsevier
  • Release : 24 January 2002
  • ISBN : 008049224X
  • Pages : 288 pages
  • Rating : 4/5 from 21 reviews
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Read or download book entitled Reflow Soldering Processes written by Ning-Cheng Lee which was release on 24 January 2002, this book published by Elsevier. Available in PDF, EPUB and Kindle Format. Book excerpt: Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well as students in process engineering classes, Reflow Soldering Processes and Troubleshooting will be a strong contender in the continuing skill development market for manufacturing personnel. Written using a very practical, hands-on approach, Reflow Soldering Processes and Troubleshooting provides the means for engineers to increase their understanding of the principles of soldering, flux, and solder paste technology. The author facilitates learning about other essential topics, such as area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and rework process,--and provides an increased understanding of the reliability failure modes of soldered SMT components. With cost effectiveness foremost in mind, this book is designed to troubleshoot errors or problems before boards go into the manufacturing process, saving time and money on the front end. The author's vast expertise and knowledge ensure that coverage of topics is expertly researched, written, and organized to best meet the needs of manufacturing process engineers, students, practitioners, and anyone with a desire to learn more about reflow soldering processes. Comprehensive and indispensable, this book will prove a perfect training and reference tool that readers will find invaluable. Provides engineers the cutting-edge technology in a rapidly changing field Offers in-depth coverage of the principles of soldering, flux, solder paste technology, area array packages--including BGA, CSP, and FC designs, bumping technique, assembly, and the rework process

Reflow Soldering Processes

Reflow Soldering Processes
  • Author : Ning-Cheng Lee
  • Publisher : Elsevier
  • Release Date : 2002-01-24
  • Total pages : 288
  • ISBN : 008049224X
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Summary : Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well ...

Reflow Soldering

Reflow Soldering
  • Author : Balázs Illés,Oliver Krammer,Attila Geczy
  • Publisher : Elsevier
  • Release Date : 2020-07-02
  • Total pages : 294
  • ISBN : 008049224X
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Summary : Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special ...

Reflow Soldering Processes and Troubleshooting

Reflow Soldering Processes and Troubleshooting
  • Author : Ning-Cheng Lee
  • Publisher : Newnes
  • Release Date : 2002-01
  • Total pages : 270
  • ISBN : 008049224X
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Summary : Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared toward electronics manufacturing process engineers, design engineers, as well ...

Reflow Soldering

Reflow Soldering
  • Author : Habil. Illes Balazs,Oliver Krammer,Attila Geczy
  • Publisher : Elsevier
  • Release Date : 2020-07-15
  • Total pages : 304
  • ISBN : 008049224X
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Summary : Reflow Soldering: Apparatus and Heat Transfer Processes investigates the technology of reflow soldering from the aspect of the soldering ovens and apparatus. The authors begin by introducing the concept of surface mount technology. This is followed by three chapters exploring: Infrared ovens, convection ovens, Vapor Phase Soldering (VPS), and special ...

Soldering Processes and Equipment

Soldering Processes and Equipment
  • Author : Michael Pecht
  • Publisher : John Wiley & Sons
  • Release Date : 1993-08-30
  • Total pages : 312
  • ISBN : 008049224X
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Summary : Addresses the key aspects of modern soldering technology and the methods used in the manufacturing process of microelectronic chips and electronic circuit boards. Demonstrates how to control contamination during cleaning procedures. Covers material dynamics of heat soldering incurred during the assembly of diverse substances. Features techniques to assure reliability and ...

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  • Author : Dongkai Shangguan
  • Publisher : ASM International
  • Release Date : 2005
  • Total pages : 292
  • ISBN : 008049224X
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Summary : Download or read online Lead Free Solder Interconnect Reliability written by Dongkai Shangguan, published by ASM International which was released on 2005. Get Lead Free Solder Interconnect Reliability Books now! Available in PDF, ePub and Kindle....

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  • Publisher : ASM International
  • Release Date : 2012
  • Total pages : 516
  • ISBN : 008049224X
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Summary : Download or read online Brazing and Soldering 2012 written by Robbin Gourley, published by ASM International which was released on 2012. Get Brazing and Soldering 2012 Books now! Available in PDF, ePub and Kindle....

Lead free Soldering Process Development and Reliability

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  • Author : Jasbir Bath
  • Publisher : John Wiley & Sons
  • Release Date : 2020-06-12
  • Total pages : 512
  • ISBN : 008049224X
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Summary : Covering the major topics in lead-free soldering Lead-free Soldering Process Development and Reliability provides a comprehensive discussion of all modern topics in lead-free soldering. Perfect for process, quality, failure analysis and reliability engineers in production industries, this reference will help practitioners address issues in research, development and production. Among other ...

Springer Handbook of Mechanical Engineering

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  • Author : Karl-Heinrich Grote,Erik K. Antonsson
  • Publisher : Springer Science & Business Media
  • Release Date : 2009-01-13
  • Total pages : 1580
  • ISBN : 008049224X
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Summary : This resource covers all areas of interest for the practicing engineer as well as for the student at various levels and educational institutions. It features the work of authors from all over the world who have contributed their expertise and support the globally working engineer in finding a solution for ...

Microelectronics Technology and Devices SBMICRO 2003

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  • Author : J. A. Martino,Sociedade Brasileira de Microeletrônica
  • Publisher : The Electrochemical Society
  • Release Date : 2003
  • Total pages : 462
  • ISBN : 008049224X
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Summary : Download or read online Microelectronics Technology and Devices SBMICRO 2003 written by J. A. Martino,Sociedade Brasileira de Microeletrônica, published by The Electrochemical Society which was released on 2003. Get Microelectronics Technology and Devices SBMICRO 2003 Books now! Available in PDF, ePub and Kindle....

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Manufacturing Challenges in Electronic Packaging
  • Author : Y.C. Lee,W.T. Chen
  • Publisher : Springer Science & Business Media
  • Release Date : 2012-12-06
  • Total pages : 261
  • ISBN : 008049224X
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Summary : About five to six years ago, the words 'packaging and manufacturing' started to be used together to emphasize that we have to make not only a few but thousands or even millions of packages which meet functional requirements. The aim of this book is to provide the much needed reviews ...

The Electronics Handbook

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  • Author : Jerry C. Whitaker
  • Publisher : CRC Press
  • Release Date : 1996-12-23
  • Total pages : 2575
  • ISBN : 008049224X
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Summary : The superb organization of The Electronics Handbook means that it is not only a comprehensive and fascinating reference, but also a pleasure to use. Some of these organizational features include:...

Soldering

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  • Author : Mel M. Schwartz
  • Publisher : ASM International
  • Release Date : 2014-03-01
  • Total pages : 206
  • ISBN : 008049224X
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Summary : Covers various soldering methods and techniques as well as the latest on solder alloys, solder films, surface preparation, fluxes and cleaning methods, heating methods, inspection techniques, and quality control and reliability. Geared to scientists, material engineers, designers, manufacturing engineers, and technologists who need immediate practical guidance rather than theoretical instruction....

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  • Author : Anonim
  • Publisher : ASM International
  • Release Date : 1989-11-01
  • Total pages : 1224
  • ISBN : 008049224X
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Summary : Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and ...

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  • Author : Kraig Mitzner
  • Publisher : Newnes
  • Release Date : 2009-05-28
  • Total pages : 488
  • ISBN : 008049224X
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Summary : This book provides instruction on how to use the OrCAD design suite to design and manufacture printed circuit boards. The primary goal is to show the reader how to design a PCB using OrCAD Capture and OrCAD Editor. Capture is used to build the schematic diagram of the circuit, and ...