Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Written By Hengyun Zhang
Modeling  Analysis  Design  and Tests for Electronics Packaging beyond Moore
  • Publsiher : Woodhead Publishing
  • Release : 22 November 2019
  • ISBN : 0081025335
  • Pages : 434 pages
  • Rating : 4/5 from 21 reviews
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Read or download book entitled Modeling Analysis Design and Tests for Electronics Packaging beyond Moore written by Hengyun Zhang which was release on 22 November 2019, this book published by Woodhead Publishing. Available in PDF, EPUB and Kindle Format. Book excerpt: Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and thermal integrity. It also covers modeling methods to address thermomechanical stress related to the package structural integrity. In addition, practical design and test techniques for packages and systems are included. Includes advanced modeling and analysis methods and techniques for state-of-the art electronics packaging Features experimental characterization and qualifications for the analysis and verification of electronic packaging design Provides multiphysics modeling and analysis techniques of electronic packaging

Modeling Analysis Design and Tests for Electronics Packaging beyond Moore

Modeling  Analysis  Design  and Tests for Electronics Packaging beyond Moore
  • Author : Hengyun Zhang,Faxing Che,Tingyu Lin,Wensheng Zhao
  • Publisher : Woodhead Publishing
  • Release Date : 2019-11-22
  • Total pages : 434
  • ISBN : 0081025335
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Summary : Modeling, Analysis, Design and Testing for Electronics Packaging Beyond Moore provides an overview of electrical, thermal and thermomechanical modeling, analysis, design and testing for 2.5D/3D. The book addresses important topics, including electrically and thermally induced issues, such as EMI and thermal issues, which are crucial to package signal and ...

Advances in Robotics Automation and Data Analytics

Advances in Robotics  Automation and Data Analytics
  • Author : Jessnor Arif Mat Jizat
  • Publisher : Springer Nature
  • Release Date : 2021-04-14
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Advances in Robotics Automation and Data Analytics written by Jessnor Arif Mat Jizat, published by Springer Nature which was released on . Get Advances in Robotics Automation and Data Analytics Books now! Available in PDF, ePub and Kindle....

VLSI Systems Design

VLSI Systems Design
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1986
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online VLSI Systems Design written by , published by which was released on 1986. Get VLSI Systems Design Books now! Available in PDF, ePub and Kindle....

Physical Design for 3D Integrated Circuits

Physical Design for 3D Integrated Circuits
  • Author : Aida Todri-Sanial,Chuan Seng Tan
  • Publisher : CRC Press
  • Release Date : 2017-12-19
  • Total pages : 397
  • ISBN : 0081025335
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Summary : Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, ...

Extending Moore s Law through Advanced Semiconductor Design and Processing Techniques

Extending Moore s Law through Advanced Semiconductor Design and Processing Techniques
  • Author : Wynand Lambrechts,Saurabh Sinha,Jassem Ahmed Abdallah,Jaco Prinsloo
  • Publisher : CRC Press
  • Release Date : 2018-09-13
  • Total pages : 354
  • ISBN : 0081025335
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Summary : This book provides a methodological understanding of the theoretical and technical limitations to the longevity of Moore’s law. The book presents research on factors that have significant impact on the future of Moore’s law and those factors believed to sustain the trend of the last five decades. Research ...

Advanced Materials Processes

Advanced Materials   Processes
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1995
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Advanced Materials Processes written by , published by which was released on 1995. Get Advanced Materials Processes Books now! Available in PDF, ePub and Kindle....

Advances in Thermal Modeling of Electronic Components and Systems Volume 4

Advances in Thermal Modeling of Electronic Components and Systems  Volume 4
  • Author : Avram Bar Cohen,Allan D. Kraus
  • Publisher : Advances in Thermal Modeling o
  • Release Date : 1998
  • Total pages : 459
  • ISBN : 0081025335
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Summary : Advances in Thermal Modeling of Electronic Components and Systems is focused on air cooling technology. The following topics are discussed in the four chapters. Thermal Analysis of Natural Convection Electronic Systems: Status and Challenges (Chapter 1). Assesses the state-of-the-art and future promise of predictive modeling techniques which incorporate numerical solutions of ...

Gallium Nitride Electronics

Gallium Nitride Electronics
  • Author : Rüdiger Quay
  • Publisher : Springer Science & Business Media
  • Release Date : 2008-04-05
  • Total pages : 470
  • ISBN : 0081025335
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Summary : This book is based on nearly a decade of materials and electronics research at the leading research institution on the nitride topic in Europe. It is a comprehensive monograph and tutorial that will be of interest to graduate students of electrical engineering, communication engineering, and physics; to materials, device, and ...

Index to IEEE Publications

Index to IEEE Publications
  • Author : Institute of Electrical and Electronics Engineers
  • Publisher : Unknown
  • Release Date : 1998
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Issues for 1973- cover the entire IEEE technical literature....

Wescon

Wescon
  • Author : Western Electronic Show and Convention
  • Publisher : Unknown
  • Release Date : 1995
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Wescon written by Western Electronic Show and Convention, published by which was released on 1995. Get Wescon Books now! Available in PDF, ePub and Kindle....

EDN

EDN
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 2009
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online EDN written by , published by which was released on 2009. Get EDN Books now! Available in PDF, ePub and Kindle....

Documentation Abstracts

Documentation Abstracts
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1993
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Documentation Abstracts written by , published by which was released on 1993. Get Documentation Abstracts Books now! Available in PDF, ePub and Kindle....

American Doctoral Dissertations

American Doctoral Dissertations
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1999
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online American Doctoral Dissertations written by , published by which was released on 1999. Get American Doctoral Dissertations Books now! Available in PDF, ePub and Kindle....

Science Abstracts

Science Abstracts
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1995
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Science Abstracts written by , published by which was released on 1995. Get Science Abstracts Books now! Available in PDF, ePub and Kindle....

Educational Technology

Educational Technology
  • Author : Anonim
  • Publisher : Unknown
  • Release Date : 1966
  • Total pages : 212
  • ISBN : 0081025335
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Summary : Download or read online Educational Technology written by , published by which was released on 1966. Get Educational Technology Books now! Available in PDF, ePub and Kindle....